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Title:
METHOD FOR FLUX-FREE SOLDERING OF ALUMINUM ALLOY, AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2023/045083
Kind Code:
A1
Abstract:
A method for flux-free soldering of aluminum alloy, comprising the following steps: (1) galvanizing a surface to be soldered of aluminum alloy to form a galvanized layer; (2) coating the galvanized layer with a flux-free solder paste, the flux-free solder paste consisting of a binder and the following components in parts by weight: 70-80 parts of a zinc-aluminum solder and 6.0-8.0 parts of rubidium-iron-boron magnetic particles; and (3) heating a part to be soldered, so that the galvanized layer and the zinc-aluminum solder form a eutectic or near-eutectic solder liquid, and applying a rotating magnetic field, so that the rubidium-iron-boron magnetic particles spin under the action of the rotating magnetic field and aluminum alloy is soldered and connected in the absence of a flux. In the method, a galvanized layer and a solder layer are diffused under the action of a concentration gradient, and then flux-free soldering of aluminum alloy is achieved under the action of spin-breaking and flow promoting of strong magnetic particles; a resulting soldering joint has fewer inclusion and air hole defects, a dense soldering seam, and high joint strength. Also disclosed is a solder paste for flux-free soldering.

Inventors:
ZHONG SUJUAN (CN)
LONG WEIMIN (CN)
HUANG JUNLAN (CN)
CHENG YAFANG (CN)
PEI YINYIN (CN)
LU QUANBIN (CN)
XUE HANGYAN (CN)
NIE MENGJIE (CN)
Application Number:
PCT/CN2021/135210
Publication Date:
March 30, 2023
Filing Date:
December 03, 2021
Export Citation:
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Assignee:
ZHENGZHOU RES INST MECHANICAL ENG CO LTD (CN)
International Classes:
B23K3/06; B23K1/002
Domestic Patent References:
WO1993008952A11993-05-13
Foreign References:
CN113732422A2021-12-03
CN109465564A2019-03-15
CN112621010A2021-04-09
US20210183545A12021-06-17
Attorney, Agent or Firm:
ZHENGZHOU RUIXIN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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