Title:
METHOD FOR FORMING BUMP OF SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/1997/018584
Kind Code:
A1
Abstract:
A method for forming a bump of a semiconductor device including an adhesive applying step of applying an adhesive to a pad electrode of a semiconductor device, a solder grain attaching step of attaching one or more solder grains to the portion of the pad electrode where the adhesive is applied, and a solder melting step of forming a bump by melting the solder grains. In the solder melting step, a metallic core is put in the bump. Therefore, a semiconductor device where a highly reliable bump is formed is obtained through simple steps.
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Inventors:
SATOU TETSUO (JP)
ISHIDA YOSHIHIRO (JP)
ISHIDA YOSHIHIRO (JP)
Application Number:
PCT/JP1996/002871
Publication Date:
May 22, 1997
Filing Date:
October 03, 1996
Export Citation:
Assignee:
CITIZEN WATCH CO LTD (JP)
SATO TETSUO (JP)
ISHIDA YOSHIHIRO (JP)
SATO TETSUO (JP)
ISHIDA YOSHIHIRO (JP)
International Classes:
H05K3/34; H01L21/60; (IPC1-7): H01L21/321; H01L21/60
Foreign References:
| JPH07288255A | 1995-10-31 | |||
| JPH04258131A | 1992-09-14 | |||
| JPH0395636A | 1991-04-22 | |||
| JPH03145732A | 1991-06-20 | |||
| JPH05191019A | 1993-07-30 | |||
| JPH05136146A | 1993-06-01 | |||
| JPS60116157A | 1985-06-22 | |||
| JPH08139097A | 1996-05-31 |
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