Title:
METHOD FOR FORMING COMPOSITE MATERIAL STRUCTURE COMPRISING Z-PINS, AND COMPOSITE MATERIAL STRUCTURE PREPARED THEREBY
Document Type and Number:
WIPO Patent Application WO/2022/158688
Kind Code:
A1
Abstract:
The present invention relates to a method for forming a composite material structure comprising Z-pins, and a composite material structure prepared thereby, the method comprising: a mold preparing step of preparing a mold; a mold processing step of forming an insertion groove on the upper surface of the mold such that a Z-pin patch can be embedded therein; a Z-pin patch inserting step of inserting the Z-pin patch in the insertion groove; a fiber sheet laminating step of laminating a fiber sheet on the upper surface of the mold; a vacuuming step of placing vacuum system materials to turn the inside of the mold into a vacuum state; a resin injecting step of injecting resin after the vacuuming step; a demolding step of demolding the cured fiber sheet from the mold after the resin injecting step; and a patch removing step of removing a patch part of the Z-pinning patch attached to the composite material structure.
Inventors:
JEONG KYUNG WOO (KR)
LEE SEUNG HO (KR)
LEE SEUNG HO (KR)
Application Number:
PCT/KR2021/016609
Publication Date:
July 28, 2022
Filing Date:
November 15, 2021
Export Citation:
Assignee:
S COMTECH INC (KR)
International Classes:
B29C70/48; B29C70/46; B29C70/68
Foreign References:
| KR20170068758A | 2017-06-20 | |||
| KR101571976B1 | 2015-11-25 | |||
| KR20120105935A | 2012-09-26 | |||
| KR20130038139A | 2013-04-17 | |||
| US5919413A | 1999-07-06 |
Attorney, Agent or Firm:
JUNG, Jin Suk (KR)
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