Title:
METHOD FOR FORMING ELECTROCONDUCTIVE-LAYER-EQUIPPED RESIN SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/243528
Kind Code:
A1
Abstract:
This method for forming an electroconductive-layer-equipped resin substrate (1) includes a roughening step, a blasting step, a reformation step, a first electroconductive layer formation step, and a second electroconductive layer formation step. In the roughening step, a surface (12A) of an insulation resin substrate (12) is roughened. In the blasting step, the roughened surface (12A) of the insulation resin substrate (12) is blasted through dry blasting. In the reformation step, the blasted surface (12A) of the insulation resin substrate (12) is reformed. In the first electroconductive layer formation step, a first electroconductive layer (16) is formed on the reformed insulation resin substrate (12). In the second electroconductive layer formation step, a second electroconductive layer (18) is formed on the first electroconductive layer (16) through a wet film formation process.
Inventors:
KOKUBO MITSUNORI (JP)
FUKADA KAZUHIRO (JP)
UEYAMA HIROYUKI (JP)
FUKADA KAZUHIRO (JP)
UEYAMA HIROYUKI (JP)
Application Number:
PCT/JP2023/021330
Publication Date:
December 21, 2023
Filing Date:
June 08, 2023
Export Citation:
Assignee:
SHIBAURA MACHINE CO LTD (JP)
International Classes:
H05K3/38; C23C28/00
Foreign References:
| JP2001119127A | 2001-04-27 | |||
| JP2015040324A | 2015-03-02 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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