Title:
METHOD OF FORMING INSULATING FILM
Document Type and Number:
WIPO Patent Application WO/2014/061590
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a smooth insulating film having the characteristics of high voltage resistance and high visible light permeability while being devoid of cracking and surface irregularities regardless of the presence of irregularities in a substrate due to an electrode, etc. The present invention provides a method of forming an insulating film comprising a coating step, a semi-curing step, and a firing step. In the coating step, a substrate having irregularities is coated with an insulating paste containing a heat polymerization initiator, a thermosetting component, and glass particles to obtain a coating film. In the semi-curing step, the coating film is heated at a temperature T1 and then cooled to a temperature T2 that is lower than T1 to obtain a semi-cured film that has been 30 to 95% cured. In the firing step, the semi-cured film is heated to obtain an insulating film.
More Like This:
Inventors:
ISHIKAWA AKIHIRO (JP)
MITSUI HIROKO (JP)
MATSUMURA NOBUO (JP)
MITSUI HIROKO (JP)
MATSUMURA NOBUO (JP)
Application Number:
PCT/JP2013/077769
Publication Date:
April 24, 2014
Filing Date:
October 11, 2013
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
B05D5/12; B05D3/02; B05D7/24; H01J5/10; H01J9/02; H01J11/38
Foreign References:
| JP2009266658A | 2009-11-12 | |||
| JP2001026477A | 2001-01-30 |
Download PDF: