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Title:
METHOD OF FORMING A MULTI-LAYER SEMICONDUCTOR STRUCTURE INCORPORATING A PROCESSING HANDLE MEMBER
Document Type and Number:
WIPO Patent Application WO2004061953
Kind Code:
A3
Abstract:
A method of forming a multi-layer semiconductor structure includes attaching a handle-member to a first semiconductor structure, disposing the first semiconductor structure on a second semiconductor structure using the handle and removing the handle to provide the multi-layer semiconductor structure.

Inventors:
REIF RAFAEL
FAN ANDY
Application Number:
PCT/US2003/041559
Publication Date:
June 23, 2005
Filing Date:
December 30, 2003
Export Citation:
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Assignee:
MASSACHUSETTS INST TECHNOLOGY (US)
International Classes:
H01L21/60; H01L21/68; H01L23/48; H01L23/522; H01L25/065; (IPC1-7): H01L21/98; H01L21/68
Foreign References:
EP1041624A12000-10-04
US5563084A1996-10-08
DE10047963A12001-03-29
EP1432032A22004-06-23
US5391257A1995-02-21
US6027958A2000-02-22
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