Title:
METHOD FOR FORMING MULTILAYER WIRING, AND STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2019/151078
Kind Code:
A1
Abstract:
A method for forming a multilayer wiring according to an embodiment is a method for forming a buried type multilayer wiring, the method comprising the steps for: forming a monomolecular film (80) on a bottom surface (73) where a wiring (50) of a substrate is exposed in a via (70) which is formed at a predetermined position of an insulating film (60) provided on the wiring (50) and penetrates to the wiring (50); forming a barrier film (81) on a side surface (72) of the via (70); removing the monomolecular film (80); and forming an electroless plated film (82) from a bottom surface (73) of the via (70) by using, as a catalyst, the wiring (50) exposed on the bottom surface (73) of the via (70).
Inventors:
TANAKA TAKASHI (JP)
IWASHITA MITSUAKI (JP)
IWASHITA MITSUAKI (JP)
Application Number:
PCT/JP2019/002070
Publication Date:
August 08, 2019
Filing Date:
January 23, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/768; C23C18/18; H01L23/522
Foreign References:
| JP2015079885A | 2015-04-23 | |||
| JP2002026055A | 2002-01-25 | |||
| JP2001323381A | 2001-11-22 | |||
| JP2010245494A | 2010-10-28 | |||
| JP2015161020A | 2015-09-07 | |||
| JP2015101738A | 2015-06-04 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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