Title:
METHOD FOR FORMING PATTERN, RESIST COMPOSITION, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/044469
Kind Code:
A1
Abstract:
Provided is a method for forming a pattern with which it is possible to obtain a pattern that excels in rectangularity. Also provided are a resist composition used in the method for forming the pattern, and a method for manufacturing an electronic device. The method for forming the pattern includes the steps of: exposing, using an i ray, a resist film that includes a novolac resin and a photo-acid generator that generates acid by exposure to an i ray, the content of the novolac resin being 50 mass% or greater with respect to the total solid content of the resist film; and developing the resist film using a developer that contains an organic solvent and forming a pattern.
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Inventors:
TAKAKUWA HIDEKI (JP)
MIZUTANI KAZUYOSHI (JP)
MIZUTANI KAZUYOSHI (JP)
Application Number:
PCT/JP2018/030134
Publication Date:
March 07, 2019
Filing Date:
August 10, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/038; G03F7/004; G03F7/20; G03F7/32
Domestic Patent References:
| WO2016194769A1 | 2016-12-08 |
Foreign References:
| JP2010026278A | 2010-02-04 | |||
| JP2010032991A | 2010-02-12 | |||
| JP2017078852A | 2017-04-27 | |||
| JP2013140336A | 2013-07-18 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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