Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD OF FORMING PATTERNS
Document Type and Number:
WIPO Patent Application WO/2023/003215
Kind Code:
A1
Abstract:
The present invention relates to a method of forming patterns, the method comprising: a step of coating a metal-containing resist composition on a substrate; a step of coating a composition for edge bead removal along the edge of the substrate; a heat treatment step of forming a metal-containing resist film on the substrate by drying and heating; and a step of forming resist patterns by exposure and development, wherein the composition for edge bead removal contains an organic solvent and at least one additive among a phosphoric acid-based compound, a hypophosphorous acid-based compound, a sulfurous acid-based compound, and a hydroxamic acid-based compound.

Inventors:
HEO RYUNMIN (KR)
MOON HYUNGRANG (KR)
LEE MINYOUNG (KR)
KIM MINSOO (KR)
KIM YOUNGKWON (KR)
KIM JAEHYUN (KR)
WOO CHANGSOO (KR)
Application Number:
PCT/KR2022/009599
Publication Date:
January 26, 2023
Filing Date:
July 04, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SAMSUNG SDI CO LTD (KR)
International Classes:
G03F7/16; C11D7/32; C11D7/36; C11D7/50; C11D11/00; G03F7/004; G03F7/40; H01L21/027
Foreign References:
KR20190030231A2019-03-21
KR20210062762A2021-06-01
KR20040037643A2004-05-07
KR101459725B12014-11-12
US9760007B22017-09-12
Attorney, Agent or Firm:
PANKOREA PATENT AND LAW FIRM (KR)
Download PDF: