Title:
METHOD OF FORMING PATTERNS
Document Type and Number:
WIPO Patent Application WO/2023/003215
Kind Code:
A1
Abstract:
The present invention relates to a method of forming patterns, the method comprising: a step of coating a metal-containing resist composition on a substrate; a step of coating a composition for edge bead removal along the edge of the substrate; a heat treatment step of forming a metal-containing resist film on the substrate by drying and heating; and a step of forming resist patterns by exposure and development, wherein the composition for edge bead removal contains an organic solvent and at least one additive among a phosphoric acid-based compound, a hypophosphorous acid-based compound, a sulfurous acid-based compound, and a hydroxamic acid-based compound.
Inventors:
HEO RYUNMIN (KR)
MOON HYUNGRANG (KR)
LEE MINYOUNG (KR)
KIM MINSOO (KR)
KIM YOUNGKWON (KR)
KIM JAEHYUN (KR)
WOO CHANGSOO (KR)
MOON HYUNGRANG (KR)
LEE MINYOUNG (KR)
KIM MINSOO (KR)
KIM YOUNGKWON (KR)
KIM JAEHYUN (KR)
WOO CHANGSOO (KR)
Application Number:
PCT/KR2022/009599
Publication Date:
January 26, 2023
Filing Date:
July 04, 2022
Export Citation:
Assignee:
SAMSUNG SDI CO LTD (KR)
International Classes:
G03F7/16; C11D7/32; C11D7/36; C11D7/50; C11D11/00; G03F7/004; G03F7/40; H01L21/027
Foreign References:
KR20190030231A | 2019-03-21 | |||
KR20210062762A | 2021-06-01 | |||
KR20040037643A | 2004-05-07 | |||
KR101459725B1 | 2014-11-12 | |||
US9760007B2 | 2017-09-12 |
Attorney, Agent or Firm:
PANKOREA PATENT AND LAW FIRM (KR)
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