Title:
METHOD OF FORMING RESIST PATTERN
Document Type and Number:
WIPO Patent Application WO/2006/080428
Kind Code:
A1
Abstract:
A fine high-precision resist pattern excelling in etching resistance is formed. There is provided a method of forming a resist pattern, characterized by developing a resist composition being photosensitive to given light source in accordance with lithography technique and bringing resist pattern (2) thus formed on substrate (1) into contact with supercritical treatment liquid (5’) consisting of supercritical fluid (3’) containing crosslinking agent (4).
Inventors:
NAMATSU HIDEO (JP)
SATO MITSURU (JP)
SATO MITSURU (JP)
Application Number:
PCT/JP2006/301297
Publication Date:
August 03, 2006
Filing Date:
January 27, 2006
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE (JP)
TOKYO OHKA KOGYO CO LTD (JP)
NAMATSU HIDEO (JP)
SATO MITSURU (JP)
TOKYO OHKA KOGYO CO LTD (JP)
NAMATSU HIDEO (JP)
SATO MITSURU (JP)
International Classes:
G03F7/40; H01L21/027
Foreign References:
JP2003140359A | 2003-05-14 | |||
JP2004233953A | 2004-08-19 | |||
JP2004233954A | 2004-08-19 | |||
JP2000112150A | 2000-04-21 | |||
JP2000089477A | 2000-03-31 | |||
JP2005223118A | 2005-08-18 |
Attorney, Agent or Firm:
Shiga, Masatake (Yaesu Chuo-ku Tokyo, 53, JP)
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