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Title:
METHOD OF FORMING THICK FILM OF OXIDE SUPERCONDUCTOR
Document Type and Number:
WIPO Patent Application WO/2007/069723
Kind Code:
A1
Abstract:
A method of forming a thick film of oxide superconductor, in which with respect to a Bi2223 thick film formed on a treatment object, without lowering of Jc, the adherence to the treatment object is increased so as to attain an enlargement of the sectional area of the Bi2223 thick film. A mixture of Pb and composite oxide with Bi2212 formulation is applied to a surface of treatment object, and fired to thereby form a first thick film. On this first thick film, there is formed a thick film of oxide superconductor represented by the general formula: (Bi,Pb)2+aSr2Ca2Cu3O2 (provided that -0.1≤a≤0.5).

Inventors:
KOJIMA MASAHIRO (JP)
KAWAHARA MASAKAZU (JP)
ICHIKAWA MICHIHARU (JP)
KADO HIROYUKI (JP)
Application Number:
PCT/JP2006/325044
Publication Date:
June 21, 2007
Filing Date:
December 15, 2006
Export Citation:
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Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
CENTRAL RES INST ELECT (JP)
KOJIMA MASAHIRO (JP)
KAWAHARA MASAKAZU (JP)
ICHIKAWA MICHIHARU (JP)
KADO HIROYUKI (JP)
International Classes:
C01G29/00; C01G1/00; H01B12/06; H01B13/00
Foreign References:
JP2004182570A2004-07-02
JP2004026625A2004-01-29
JPH02217320A1990-08-30
JPH02162616A1990-06-22
Other References:
See also references of EP 1961703A4
Attorney, Agent or Firm:
ANIYA, Setuo et al. (4-6-1 Iidabashi, Chiyoda-k, Tokyo 72, JP)
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