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Patent Searching and Data


Title:
METHOD FOR FORMING THIN FILM USING SURFACE PROTECTION MATERIAL
Document Type and Number:
WIPO Patent Application WO/2021/096326
Kind Code:
A1
Abstract:
According to one embodiment of the present invention, a method for forming a thin film using a surface protection material comprises: a surface protection layer forming step of forming a surface protection layer on the surface of a substrate by supplying a surface protection material to the inside of a chamber in which the substrate is placed; a step of performing a primary purging of the inside of the chamber; a metal precursor supply step of supplying a metal precursor to the inside of the chamber; a step of performing a secondary purging of the inside of the chamber; and a thin film forming step of supplying a reactive material to the inside of the chamber so as to react with the metal precursor and form a thin film.

Inventors:
LEE GEUN SU (KR)
KIM JAE MIN (KR)
KIM HA NA (KR)
CHOI WOONG JIN (KR)
Application Number:
PCT/KR2020/016102
Publication Date:
May 20, 2021
Filing Date:
November 16, 2020
Export Citation:
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Assignee:
EUGENE TECH MATERIALS (KR)
International Classes:
C23C16/455; C23C16/02; C23C16/40; C23C16/44; H01L27/108; H01L49/02
Foreign References:
KR20170016748A2017-02-14
US20100036144A12010-02-11
KR20180114536A2018-10-18
KR20050081022A2005-08-18
JP2003231738A2003-08-19
KR102095710B12020-04-01
Attorney, Agent or Firm:
JEONG, Seong-Jin (KR)
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