Title:
METHOD FOR INSPECTING SEMICONDUCTOR AND SEMICONDUCTOR INSPECTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/246150
Kind Code:
A1
Abstract:
This method for inspecting a semiconductor with an observation system 1 comprises: a step for acquiring a first pattern image that indicates a semiconductor device S pattern; a step for acquiring a second pattern image that indicates the semiconductor device S pattern, the image having a resolution different from that of the first pattern image; a step for learning by machine learning reconfiguration processing for the second pattern image using the first patten image as teaching data, then reconfiguring the second pattern image into a reconfigured image having a resolution different from that of the second pattern image, the reconfiguration performed using the reconfiguration processing based on the results of said learning; and a step for performing position adjustment on the basis of the first pattern image and an area, in the reconfigured image, calculated as having a high degree of certainty by the reconfiguration processing.
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Inventors:
TAKESHIMA TOMOCHIKA (JP)
HIGUCHI TAKAFUMI (JP)
HOTTA KAZUHIRO (JP)
HIGUCHI TAKAFUMI (JP)
HOTTA KAZUHIRO (JP)
Application Number:
PCT/JP2020/016753
Publication Date:
December 10, 2020
Filing Date:
April 16, 2020
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
G06T7/00; G06N3/04; G06N3/08; G06N20/00; G06T7/30; H01L21/66
Domestic Patent References:
| WO2015098342A1 | 2015-07-02 |
Foreign References:
| JP2009162718A | 2009-07-23 | |||
| US20170193680A1 | 2017-07-06 | |||
| US20170345140A1 | 2017-11-30 | |||
| US20170148226A1 | 2017-05-25 | |||
| JP2019129169A | 2019-08-01 | |||
| US20180293346A1 | 2018-10-11 |
Other References:
See also references of EP 3958210A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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