Title:
METHOD OF MANUFACTURING CARRIER WAFER AND RESULTING CARRIER WAFER STRUCTURES
Document Type and Number:
WIPO Patent Application WO2006031641
Kind Code:
A3
Abstract:
A method is disclosed for preparing carrier wafers for semiconductor device manufacture. The method includes the steps of sorting a plurality of standard carrier wafer blanks into batches by thickness to define a batch of starting carrier wafers that are within a predetermined tolerance of one another, reducing the thickness of the sorted carrier wafers to within 10 microns of a final target thickness, and polishing the sorted carrier wafers to the final target thickness. The polished carrier wafers are mounted to device precursor wafers having at least one semiconductor epitaxial layer on a substrate by joining one surface of a carrier wafer to the epitaxial layer on a substrate. The thickness of the device precursor wafer is then reduced by removing material from the device precursor substrate opposite the joined epitaxial layer.
Inventors:
BRITT JEFFREY CARL (US)
LAUGHNER MICHAEL PAUL (US)
HARDIN CRAIG WILLIAM (US)
LAUGHNER MICHAEL PAUL (US)
HARDIN CRAIG WILLIAM (US)
Application Number:
PCT/US2005/032115
Publication Date:
July 27, 2006
Filing Date:
September 09, 2005
Export Citation:
Assignee:
CREE INC (US)
BRITT JEFFREY CARL (US)
LAUGHNER MICHAEL PAUL (US)
HARDIN CRAIG WILLIAM (US)
BRITT JEFFREY CARL (US)
LAUGHNER MICHAEL PAUL (US)
HARDIN CRAIG WILLIAM (US)
International Classes:
H01L21/304; H01L33/00
Domestic Patent References:
| WO1998009804A1 | 1998-03-12 |
Foreign References:
| US20010035580A1 | 2001-11-01 | |||
| US6281032B1 | 2001-08-28 |
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