Title:
METHOD FOR MANUFACTURING CHIP OF THERMOELECTRIC CONVERSION MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/196709
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a chip of a thermoelectric conversion material, the method making it possible to perform, in a simple step, annealing of the thermoelectric conversion material in a way that does not involve a junction with an electrode, and making it possible to anneal a thermoelectric semiconductor material at an optimum annealing temperature, the thermoelectric conversion material comprising a thermoelectric semiconductor composition. The method comprises: (A) a step for forming a chip of the thermoelectric conversion material on a substrate; (B) a step for annealing the chip of the thermoelectric conversion material obtained in the step of (A); and (C) a step for peeling the chip of the thermoelectric conversion material after annealing, obtained in the step of (B). The thermoelectric semiconductor composition includes a thermoelectric semiconductor material and a resin, and the temperature of the annealing is not lower than the decomposition temperature of the resin.
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Inventors:
KATO KUNIHISA (JP)
MORITA WATARU (JP)
MORITA WATARU (JP)
Application Number:
PCT/JP2020/013547
Publication Date:
October 01, 2020
Filing Date:
March 26, 2020
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L35/34; H01L35/16; H01L35/32
Domestic Patent References:
WO2013069347A1 | 2013-05-16 | |||
WO2020045379A1 | 2020-03-05 |
Foreign References:
JP2000183412A | 2000-06-30 | |||
US7531739B1 | 2009-05-12 | |||
JP2017098283A | 2017-06-01 | |||
US20030041892A1 | 2003-03-06 | |||
JP2013251333A | 2013-12-12 | |||
JP2017041540A | 2017-02-23 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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