Title:
METHOD FOR MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/255258
Kind Code:
A1
Abstract:
The present invention provides a method for manufacturing a circuit board and a circuit board manufacturing device which can reduce the effects of thermal stress on a circuit board by reducing the number of heating steps in a method for manufacturing a circuit board by an additive manufacturing method. This method for manufacturing a circuit board circuit includes: a substrate forming step of forming a circuit board having wiring by additive manufacturing on a peel member affixed to a base member; an adhering step of adhering a metal paste that contacts the wiring to the circuit board; an electronic component arranging step of arranging an electronic component on the circuit board and arranging the electronic component and the wiring with the metal paste therebetween; and a hot-pressing step of arranging a press member above the circuit board and heating the peel member and the metal paste together while pressing the circuit board with the base member and the press member to correct warping of the circuit board, to thereby facilitate peeling of the peel member from the base member and cure the metal paste.
Inventors:
TSUKADA KENJI (JP)
Application Number:
PCT/JP2019/024111
Publication Date:
December 24, 2020
Filing Date:
June 18, 2019
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H01L23/12; H05K3/00
Domestic Patent References:
| WO2016125275A1 | 2016-08-11 | |||
| WO2016042657A1 | 2016-03-24 | |||
| WO2015041189A1 | 2015-03-26 |
Foreign References:
| JP2017130553A | 2017-07-27 | |||
| JP2007311476A | 2007-11-29 |
Other References:
See also references of EP 3989275A4
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
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