METHOD FOR MANUFACTURING CIRCUIT BOARD, AND CIRCUIT BOARD OBTAINED USING THE MANUFACTURING METHOD

Title:

METHOD FOR MANUFACTURING CIRCUIT BOARD, AND CIRCUIT BOARD OBTAINED USING THE MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2010/064602

Kind Code:

A1

Abstract:

A method for manufacturing a circuit board is provided with: a film forming step of forming a resin film on the surface of an insulating base material; a circuit pattern forming step of forming a circuit pattern section by forming a recessed section having a depth equivalent to the thickness of the resin film or more, with the outer surface of the resin film as a reference; a catalyst applying step of applying a plating catalyst or the precursor thereof on the surface of the circuit pattern section and on the surface of the resin film; a film removing step of removing the resin film from the insulating base material; and a plating step of forming an electroless plating film only on a portion where the plating catalyst or the precursor thereof remains after removing the resin film.

Inventors:

YOSHIOKA SHINGO (JP)
FUJIWARA HIROAKI (JP)

Application Number:

PCT/JP2009/070106

Publication Date:

June 10, 2010

Filing Date:

November 30, 2009

Export Citation:

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Assignee:

PANASONIC ELEC WORKS CO LTD (JP)
YOSHIOKA SHINGO (JP)
FUJIWARA HIROAKI (JP)

International Classes:

H05K3/10; H05K3/18; H05K3/22

Foreign References:

JP2007088288A	2007-04-05
JPS63183445A	1988-07-28
JP2004281427A	2004-10-07
JP2003309346A	2003-10-31
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JP2008058710A	2008-03-13
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JP2004048030A	2004-02-12
JPH1078654A	1998-03-24
JP2002252445A	2002-09-06
JPH07509322A	1995-10-12
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Other References: