Title:
METHOD FOR MANUFACTURING CIRCUIT BOARD SOLDER PAD
Document Type and Number:
WIPO Patent Application WO/2022/174627
Kind Code:
A1
Abstract:
Disclosed in the present invention is a method for manufacturing a circuit board solder pad, comprising: S1, plating a solder pad: increasing the thickness of the solder pad in a selective plating mode; S2, pre-processing; S3, laminating and curing: performing vacuum laminating and curing on an insulation layer; and S4, grinding: exposing the solder pad by means of grinding. In the method for manufacturing the circuit board solder pad, by means of an opening mode of exposing the solder pad by grinding, machinability of design of a high-density and fine-pitch solder pad is effectively improved, the solder pad is effectively prevented from falling off, flatness of a product is improved, and the packaging reliability of the product is improved.
Inventors:
YANG GUI (CN)
LI BO (CN)
FAN TINGHUI (CN)
QIAO YUAN (CN)
WU SHOUKUN (CN)
LIU MIN (CN)
XIAO XIN (CN)
WANG BIN (CN)
KE HAN (CN)
LI BO (CN)
FAN TINGHUI (CN)
QIAO YUAN (CN)
WU SHOUKUN (CN)
LIU MIN (CN)
XIAO XIN (CN)
WANG BIN (CN)
KE HAN (CN)
Application Number:
PCT/CN2021/130128
Publication Date:
August 25, 2022
Filing Date:
November 11, 2021
Export Citation:
Assignee:
HUIZHOU KING BROTHER CIRCUIT TECHNOLOGY CO LTD (CN)
SHENZHEN KING BROTHER ELECTRONIC TECHNOLOGY CO LTD (CN)
XIAN KING BROTHER CIRCUIT TECH CO LTD (CN)
SHENZHEN KING BROTHER ELECTRONIC TECHNOLOGY CO LTD (CN)
XIAN KING BROTHER CIRCUIT TECH CO LTD (CN)
International Classes:
H05K3/28
Foreign References:
| CN113038731A | 2021-06-25 | |||
| CN110536564A | 2019-12-03 | |||
| JPH0923054A | 1997-01-21 | |||
| KR20090130475A | 2009-12-24 | |||
| US20020023895A1 | 2002-02-28 | |||
| US20150034365A1 | 2015-02-05 | |||
| CN110366323A | 2019-10-22 | |||
| CN109314089A | 2019-02-05 | |||
| CN109890146A | 2019-06-14 |
Attorney, Agent or Firm:
SHENZHEN QIANNA PATENT AGENCY LTD (CN)
Download PDF: