Title:
METHOD FOR MANUFACTURING CIRCUIT BOARD TO WHICH ELECTRONIC COMPONENT IS JOINED
Document Type and Number:
WIPO Patent Application WO/2014/104218
Kind Code:
A1
Abstract:
Provided are: a manufacturing method which is capable of improving the reliability of a circuit board to which an electronic component is soldered; and a method for forming a solder bump. The present invention relates to a method for manufacturing a circuit board to which an electronic component is joined, said method comprising the following steps (a)-(e).
(a) a step wherein a solder transfer sheet is disposed on a first surface of a circuit board so that a solder layer of the transfer sheet faces the first surface, which has a soldering part
(b) a step wherein the circuit board, on which the transfer sheet is disposed, is heated under pressure at a temperature that is lower than the solidus temperature of the solder alloy, thereby selectively causing solid-phase diffusion bonding between the soldering part of the circuit board and the solder layer of the transfer sheet
(c) a step wherein the transfer sheet and the circuit board are separated from each other, thereby obtaining the circuit board wherein the solder layer is adhered to the soldering part
(d) a step wherein the circuit board is cleaned with a cleaning agent (A)
(e) a step wherein a flux is applied to the circuit board, then the circuit board is heated to a temperature that is not less than the liquidus temperature of the solder alloy so that the solder layer is melted, and then the solder layer is solidified and the flux residue is cleaned.
Inventors:
KAWASHIMO HIROKAZU
SAITOH TAKEO
IKEDA ATSUSHI
MURAOKA MANABU
OSHIMA HIROKI
TSURUTA KAICHI
SAITOH TAKEO
IKEDA ATSUSHI
MURAOKA MANABU
OSHIMA HIROKI
TSURUTA KAICHI
Application Number:
PCT/JP2013/084947
Publication Date:
July 03, 2014
Filing Date:
December 26, 2013
Export Citation:
Assignee:
KAO CORP (JP)
SENJU METAL INDUSTRY CO (JP)
SENJU METAL INDUSTRY CO (JP)
International Classes:
H05K3/34; H01L21/60; H01L23/12
Domestic Patent References:
| WO2010093031A1 | 2010-08-19 |
Foreign References:
| JPH07336033A | 1995-12-22 | |||
| JP2010507252A | 2010-03-04 | |||
| JP2007317996A | 2007-12-06 | |||
| JP2009190089A | 2009-08-27 |
Attorney, Agent or Firm:
IKEUCHI SATO & PARTNER PATENT ATTORNEYS (JP)
Patent business corporation Ikeuchi and Sato and partners (JP)
Patent business corporation Ikeuchi and Sato and partners (JP)
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