Title:
METHOD FOR MANUFACTURING CIRCUIT BOARD WITH SOFT-MAGNETIC FILM LAMINATED THERETO
Document Type and Number:
WIPO Patent Application WO/2014/192445
Kind Code:
A1
Abstract:
A method for manufacturing a circuit board with a soft-magnetic film laminated to at least one side thereof. Said method has the following steps: a step in which a semi-cured soft-magnetic heat-curable film that contains soft-magnetic grains and has a porosity between 15% and 60%, inclusive, is placed in contact with one side of a circuit board; and a step in which a vacuum heat press is used to cure the soft-magnetic heat-curable film.
Inventors:
HABU TAKASHI (JP)
EBE HIROFUMI (JP)
EBE HIROFUMI (JP)
Application Number:
PCT/JP2014/060601
Publication Date:
December 04, 2014
Filing Date:
April 14, 2014
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K9/00; H05K1/02
Foreign References:
| JP2013026324A | 2013-02-04 | |||
| JP2006032929A | 2006-02-02 | |||
| JP2002299814A | 2002-10-11 | |||
| JP2011003583A | 2011-01-06 | |||
| JP2014057041A | 2014-03-27 | |||
| JPH05158606A | 1993-06-25 | |||
| JP2006039947A | 2006-02-09 |
Other References:
See also references of EP 3007532A4
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
Hiroyuki Okamoto (JP)
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