Title:
METHOD FOR MANUFACTURING COMPONENT-EMBEDDED SUBSTRATE, AND COMPONENT-EMBEDDED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2014/184873
Kind Code:
A1
Abstract:
In a method for manufacturing a component-embedded substrate (20), a through via (16) is formed after forming an outer metal layer (14), said through via penetrating a first insulating layer (5) and a second insulating layer (11) from the outer metal layer (14), and reaching a second terminal (4b) of an IC component (4).
Inventors:
TODA MITSUAKI (JP)
MATSUMOTO TOHRU (JP)
MURATA SEIKO (JP)
MATSUMOTO TOHRU (JP)
MURATA SEIKO (JP)
Application Number:
PCT/JP2013/063432
Publication Date:
November 20, 2014
Filing Date:
May 14, 2013
Export Citation:
Assignee:
MEIKO ELECTRONICS CO LTD (JP)
International Classes:
H05K3/46
Foreign References:
| JP2007535157A | 2007-11-29 | |||
| JP2007173276A | 2007-07-05 | |||
| JP2011222554A | 2011-11-04 | |||
| JP2011522403A | 2011-07-28 | |||
| JP2001053447A | 2001-02-23 | |||
| JP4874305B2 | 2012-02-15 |
Other References:
See also references of EP 2999319A4
Attorney, Agent or Firm:
NAGATO, KANJI (JP)
Nagato δΎƒ 2 (JP)
Nagato δΎƒ 2 (JP)
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