Title:
METHOD FOR MANUFACTURING CONDUCTIVE BASE MATERIAL, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTROMAGNETIC WAVE SHIELD FILM, AND METHOD FOR MANUFACTURING SURFACE-SHAPED HEATING BODY
Document Type and Number:
WIPO Patent Application WO/2024/058112
Kind Code:
A1
Abstract:
This method for manufacturing a conductive base material includes: a coating film forming step for using a conductive composition containing conductive particles to form a coating film on a surface of a base material; and an ultrasonic wave application step for applying an ultrasonic wave to the coating film to form a conductive layer. In the manufacturing method, the ultrasonic wave vibrates in a direction parallel to the surface of the base material. In addition, in the ultrasonic wave application step, in a state in which a horn subjected to ultrasonic vibration comes into contact with the coating film, an ultrasonic wave is applied to the coating film while causing the base material and the horn to move relative to each other.
Inventors:
SHIBATA TAKESHI (JP)
OGAWA TAKAYUKI (JP)
OGAWA TAKAYUKI (JP)
Application Number:
PCT/JP2023/033023
Publication Date:
March 21, 2024
Filing Date:
September 11, 2023
Export Citation:
Assignee:
SATO HOLDINGS KK (JP)
International Classes:
B05D5/12; B05D3/12; H05K3/12; H05K9/00
Foreign References:
| JP2008086895A | 2008-04-17 | |||
| CN110429209A | 2019-11-08 | |||
| JP2001327917A | 2001-11-27 | |||
| JP2012035246A | 2012-02-23 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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