Title:
METHOD FOR MANUFACTURING CONDUCTIVE PARTICLES, ANISOTROPICALLY CONDUCTIVE ADHESIVE, AND METHOD FOR MOUNTING COMPONENT
Document Type and Number:
WIPO Patent Application WO/2016/140326
Kind Code:
A1
Abstract:
Provided is a technique with which it is possible, when forming an insulating film on the surfaces of metal particles, to minimize deformation of particles, as well as to ensure insulation between electrodes and maintain high connection reliability when connecting a substrate and a connected member. An insulating film 12 is formed on the surfaces 11 of metal particles 10 comprising a low-melting-point metal by a sputtering process while vibration is applied in an oxygen-containing atmosphere, whereby conductive particles 1 are produced. The conductive particles 1 are dispersed into a resin component, an anisotropically conductive adhesive is formed, the anisotropically conductive adhesive is arranged and pressed between electrodes, and the molten metal particles 10 are hardened to electrically connect the electrodes.
Inventors:
KUMAKURA HIROYUKI (JP)
Application Number:
PCT/JP2016/056663
Publication Date:
September 09, 2016
Filing Date:
March 03, 2016
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C23C14/34; B22F1/16; H01B1/00; H01B1/22; H01B5/16; H01B13/00; H01L21/60; H05K3/32
Foreign References:
| JP2000315422A | 2000-11-14 | |||
| JPS5641375A | 1981-04-18 | |||
| JPH1161399A | 1999-03-05 | |||
| JP2007204786A | 2007-08-16 | |||
| JP2005042192A | 2005-02-17 |
Attorney, Agent or Firm:
ISHIJIMA, Shigeo et al. (JP)
Shigeo Ishijima (JP)
Shigeo Ishijima (JP)
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