METHOD FOR MANUFACTURING CONDUCTOR, METHOD FOR MANUFACTURING WIRING BOARD, AND COMPOSITION FOR FORMING CONDUCTOR

Title:

METHOD FOR MANUFACTURING CONDUCTOR, METHOD FOR MANUFACTURING WIRING BOARD, AND COMPOSITION FOR FORMING CONDUCTOR

Document Type and Number:

WIPO Patent Application WO/2019/225340

Kind Code:

A1

Abstract:

Provided is a method for manufacturing a conductor, the method comprising: a step for forming a composition layer by applying, to a substrate, a composition including a nickel complex and a solvent capable of dissolving the nickel complex; and a step for irradiating the composition layer with light to cause nickel to be precipitated.

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WO/2003/069023	METHOD FOR REPAIRING FINE PATTERN AND APPARATUS FOR REPAIRING FINE PATTERN
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Inventors:

OHISHI TOMOJI (JP)
YOSHIDA YASUSHI (JP)
HIRAYAMA KATSURO (JP)

Application Number:

PCT/JP2019/018573

Publication Date:

November 28, 2019

Filing Date:

May 09, 2019

Export Citation:

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Assignee:

SHIBAURA INST TECH (JP)
MURATA MANUFACTURING CO (JP)

International Classes:

C23C18/08; H01B1/22; H01B5/14; H01B13/00; H05K3/10

Domestic Patent References:

WO2017135330A1	2017-08-10
WO2016152722A1	2016-09-29

Foreign References:

JP2014031577A	2014-02-20
JP2010500476A	2010-01-07
JPH02205686A	1990-08-15

Attorney, Agent or Firm:

NAKAJIMA, Jun et al. (JP)

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