Title:
METHOD FOR MANUFACTURING CORE BOARD HAVING BUILT-IN COMPONENTS AND METHOD FOR MANUFACTURING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/085529
Kind Code:
A1
Abstract:
The present invention relates to a method for manufacturing a core board having built-in components, comprising: S110: performing circuit manufacturing of the core board; S120: mounting and soldering correspondingly, on the core board, components to be built in; S130: covering, on the core board, a protective film having through windows matching the components, the film thickness of the protective film used being greater than the height of the soldering points of the components; S140: filling resin powder into the through windows of the protective film and vitrifying the resin powder, so as to cover the wiring pins and soldering points of the components; and S150: removing the protective film, so as to obtain a core board having built-in components. The problem of corrosion of electronic components and soldering points thereof caused by liquid medicine during brown oxidation processing is solved.
More Like This:
Inventors:
LIN CHUTAO (CN)
LI CHONG (CN)
LI ZHIDONG (CN)
LI CHONG (CN)
LI ZHIDONG (CN)
Application Number:
PCT/CN2018/093623
Publication Date:
May 09, 2019
Filing Date:
June 29, 2018
Export Citation:
Assignee:
GUANGZHOU FASTPRINT CIRCUIT TECH CO LTD (CN)
SHENZHEN FASTPRINT CIRCUIT TECH CO LTD (CN)
SHENZHEN FASTPRINT CIRCUIT TECH CO LTD (CN)
International Classes:
H05K1/14
Foreign References:
| CN106879188A | 2017-06-20 | |||
| CN204392684U | 2015-06-10 | |||
| CN105246263A | 2016-01-13 | |||
| CN106132113A | 2016-11-16 | |||
| CN108040426A | 2018-05-15 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
Download PDF: