Title:
METHOD FOR MANUFACTURING DIFFUSION COVER, DIFFUSION COVER, AND SEMICONDUCTOR LIGHT-EMITTING DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2021/210440
Kind Code:
A1
Abstract:
This manufacturing method is a method for manufacturing a diffusion cover for transmitting, while diffusing, light from a semiconductor light-emitting element. This manufacturing method comprises a step for preparing a substrate having a front surface and a back surface that face in opposite directions in the thickness direction, a step for forming a lens material comprising a photosensitive transparent resin on the front surface, and a step for removing a portion of the lens material by grayscale light exposure and development to form a lens body that has a plurality of lens parts. Through such a configuration, it is possible to provide a diffusion cover suitable for reducing manufacturing cost.
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Inventors:
NAKATANI GORO (JP)
Application Number:
PCT/JP2021/014512
Publication Date:
October 21, 2021
Filing Date:
April 05, 2021
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
G02B5/02; G02B3/00; H01L23/02; H01S5/022; H01S5/02257; H01S5/0232; H01S5/0233; H01S5/02345; H01S5/0237
Domestic Patent References:
| WO2020100890A1 | 2020-05-22 | |||
| WO2014021232A1 | 2014-02-06 | |||
| WO2020217943A1 | 2020-10-29 |
Foreign References:
| JP2020141019A | 2020-09-03 | |||
| JP2020141018A | 2020-09-03 | |||
| JP2020077678A | 2020-05-21 | |||
| JP2001255660A | 2001-09-21 | |||
| JP2006278356A | 2006-10-12 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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