Title:
METHOD FOR MANUFACTURING DISPLAY DEVICE, METHOD FOR TRANSFERRING CHIP COMPONENT, AND TRANSFER MEMBER
Document Type and Number:
WIPO Patent Application WO/2019/013120
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a display device in which a chip component is transferred reliably to a desired position on a drive circuit board, the accuracy of pixel arrangement is high, and manufacturing yield is high. The present invention includes steps for: bringing a drive circuit board (6) provided with an anisotropic conductive film (7) and a substrate (5) for transfer to which a chip component (3) has been transferred closer together, and causing the anisotropic conductive film (7) to come in contact with the chip component (3); subsequently thermocompression-bonding the substrate (5) for transfer and the drive circuit board (6) together and causing thermally expandable particles (42) to thermally expand; and then separating a transfer member layer (5) from the chip component (3) and transferring the chip component (3) to the drive circuit board (6).
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Inventors:
KAJIYAMA KOICHI (JP)
HIRANO TAKAFUMI (JP)
HIRANO TAKAFUMI (JP)
Application Number:
PCT/JP2018/025672
Publication Date:
January 17, 2019
Filing Date:
July 06, 2018
Export Citation:
Assignee:
V TECH CO LTD (JP)
International Classes:
G09F9/00; G09F9/33; H05K13/04
Domestic Patent References:
| WO2017008253A1 | 2017-01-19 |
Foreign References:
| JP2003007986A | 2003-01-10 | |||
| JP2015529400A | 2015-10-05 | |||
| JP2016525282A | 2016-08-22 | |||
| JP2000248240A | 2000-09-12 | |||
| JP2000169808A | 2000-06-20 | |||
| JPS60252681A | 1985-12-13 | |||
| JP2004273596A | 2004-09-30 |
Attorney, Agent or Firm:
NISSAY INTERNATIONAL PATENT OFFICE (JP)
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