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Title:
METHOD FOR MANUFACTURING DYE-ATTACHED SUBSTRATE, METHOD FOR MANUFACTURING DYED RESIN BODY, PRINTING CONTROL DEVICE, PRINTING DEVICE, PRINTING CONTROL PROGRAM, AND PRINTING CONTROL DATA CREATION PROGRAM
Document Type and Number:
WIPO Patent Application WO/2016/208515
Kind Code:
A1
Abstract:
A method for manufacturing a dye-attached substrate which is used in a dyeing step for dyeing a resin body by heating sublimable dye and thereby causing the dye to sublimate toward the resin body, the method comprising: an installing step of, when printing a to-be-dyed substrate, which is formed in the shape of a roll for dye attachment and of which a surface on the side for dye attachment is formed on an outer surface of the roll-shaped to-be-dyed substrate, with the dye using a printing device, installing the to-be-dyed substrate in the printing device in such a way that the outer surface of the roll-shaped to-be-dyed substrate is opposed to an ink head of the printing device; and a printing step of printing the dye onto the to-be-dyed substrate by discharging an ink containing the dye for vapor deposition on the resin body, toward the to-be-dyed substrate by means of the ink head of the printing device.

Inventors:
INUZUKA MINORU (JP)
HYODO HIROKAZU (JP)
ABE KOJI (JP)
Application Number:
PCT/JP2016/068164
Publication Date:
December 29, 2016
Filing Date:
June 17, 2016
Export Citation:
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Assignee:
NIDEK KK (JP)
International Classes:
D06P5/00; B41M5/00
Foreign References:
JP2003011935A2003-01-15
JPS6024991A1985-02-07
Other References:
See also references of EP 3315661A4
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