Title:
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/050256
Kind Code:
A1
Abstract:
Disclosed is a method for manufacturing an electronic component device, the method comprising: preparing a wiring structure including a wiring portion and a connecting portion, the wiring portion including a metal wire and an insulating layer and having two major surfaces opposing each other, the connecting portion being provided on one of the major surfaces of the wiring portion; fixing one or more conductor pins on a wiring substrate vertically with respect to the connecting portion; mounting one or more electronic components on the wiring structure; and forming on the wiring structure a sealing layer for sealing the electronic component and the conductor pin.
Inventors:
SHIBATA TOMOAKI (JP)
SUZUKI NAOYA (JP)
SUZUKI NAOYA (JP)
Application Number:
PCT/JP2021/031877
Publication Date:
March 10, 2022
Filing Date:
August 31, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L23/12
Domestic Patent References:
| WO2016181954A1 | 2016-11-17 |
Foreign References:
| JP2019068020A | 2019-04-25 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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