Title:
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/063122
Kind Code:
A1
Abstract:
Provided is a novel method for facilitating the removal of an element after processing when manufacturing an electronic component or a semiconductor device, thereby increasing productivity. In the present invention, an object to be processed for use in the manufacturing of an electronic device or a semiconductor device is bonded to a ridge-and-valley surface of an adhesive layer. A processed object is obtained by processing the object to be processed that is on the adhesive layer. The processed object is removed from the adhesive layer.
Inventors:
KONO KANAKO (JP)
NEMOTO TAKU (JP)
KIDA SATOSHI (JP)
NISHIJIMA KENTA (JP)
MASUMOTO MUTSUMI (JP)
NEMOTO TAKU (JP)
KIDA SATOSHI (JP)
NISHIJIMA KENTA (JP)
MASUMOTO MUTSUMI (JP)
Application Number:
PCT/JP2023/034243
Publication Date:
March 28, 2024
Filing Date:
September 21, 2023
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/56; C09J7/38; H01L21/301; H01L21/683
Domestic Patent References:
| WO2019172220A1 | 2019-09-12 |
Foreign References:
| JP2020061529A | 2020-04-16 | |||
| JP2021118274A | 2021-08-10 | |||
| JP2003336018A | 2003-11-28 |
Attorney, Agent or Firm:
OHTSUKA PATENT OFFICE, P.C. (JP)
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