METHOD OF MANUFACTURING ELECTRONIC COMPONENT

WIPO Patent Application WO/2005/041220

A1

A method of manufacturing an electronic component having circuit elements (3) formed on the surface of a ceramic substrate (1) and conductive balls (2) used as electronic component terminals capable of preventing an excessive stress from being concentrated to a fixed portion between the ceramic substrate (1) and the conductive balls (2). The method comprises a first step for forming the circuit elements (3) on the surface of the large ceramic substrate (1) with division grooves (4) vertically and laterally formed in the surface thereof, a second step for dividing the substrate (1) into unit electronic component pieces (10) by providing a stress to the substrate (1) so as to spread the division grooves (4), and a third step for fixing the conductive balls (2) to the terminal parts (7) of the circuit elements (3) on the divided unit electronic component pieces (10). The first, second, and third steps are performed in this order. In this case, a step for arranging the plurality of unit electronic component pieces (10) by using a container (11) is desirably be performed before starting the third step after the second step is completed.

WO/1998/011567	THIN-FILM RESISTOR AND RESISTANCE MATERIAL FOR A THIN-FILM RESISTOR
JPH0620004	[Title of the Invention] A transfer device for electronic components

SUZUKI RYUUSUKE (JP)
NAKAMORI TAKEFUMI (JP)

PCT/JP2004/013655

May 06, 2005

September 17, 2004

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MINOWA KOA INC (JP)
SUZUKI RYUUSUKE (JP)
NAKAMORI TAKEFUMI (JP)

H01C17/00; H01C17/28; (IPC1-7): H01C17/28; H01C17/06

JPH0529102A	1993-02-05
JPH0722213A	1995-01-24
JP3068022U	2000-04-21
JPH09289104A	1997-11-04
JPS57124420A	1982-08-03

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