Title:
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/181917
Kind Code:
A1
Abstract:
According to the present invention, a method for manufacturing an electronic component includes a substrate preparation step for preparing an insulative substrate, an insulation-layer-formation step for forming an insulation layer on the substrate, a penetration step for penetrating the insulation layer to form a through hole, and a wiring step for forming through-wiring in the through hole. At least a portion of a coil part wound in the form of a solenoid is formed by the through-wiring. The manufacturing method may further comprise a first metal-layer-forming step for forming a first metal layer on the substrate in advance of the insulating layer forming step. The through-wiring is connected to the first metal layer, and the coil part includes the first metal layer.
Inventors:
AOKI RYUYA (JP)
Application Number:
PCT/JP2023/008602
Publication Date:
September 28, 2023
Filing Date:
March 07, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01F41/04; H01F17/00
Foreign References:
| JPH0555043A | 1993-03-05 | |||
| JP2004063760A | 2004-02-26 | |||
| JP2007053311A | 2007-03-01 | |||
| JP2020205342A | 2020-12-24 | |||
| JP2020167574A | 2020-10-08 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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