Title:
METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COVER GLASS
Document Type and Number:
WIPO Patent Application WO/2023/032804
Kind Code:
A1
Abstract:
[Problem] To suppress out-gassing to suppress degradation of the optical characteristics of a cover glass. [Solution] This method for manufacturing an electronic device comprises: a baking step for heating a cover glass on which an antireflective layer made of a cured product of a photo-curable resin is formed; an assembly step for installing the cover glass after the baking step in a position opposite a light-receiving surface of a sensor element and assembling a sensor module; and a reflow step for placing the sensor module on a mounting substrate and heating the sensor module at a temperature greater than or equal to 250℃ to solder the sensor module onto the mounting substrate. The baking step is performed before the reflow step so that, in the reflow step, the ratio of out-gassing from the antireflective layer of the cover glass that is derived from a monomer having a monofunctional (meth)acryloyl group is less than or equal to 0.5 mass % with respect to the mass of the antireflective layer.
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Inventors:
KOKAI YUINA (JP)
SAKURAI KYOKO (JP)
SAKURAI KYOKO (JP)
Application Number:
PCT/JP2022/032025
Publication Date:
March 09, 2023
Filing Date:
August 25, 2022
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L27/146; G02B1/118
Domestic Patent References:
| WO2013187528A1 | 2013-12-19 | |||
| WO2019004406A1 | 2019-01-03 | |||
| WO2015076309A1 | 2015-05-28 |
Foreign References:
| JP2015214101A | 2015-12-03 |
Attorney, Agent or Firm:
AOMI PATENT (JP)
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