METHOD FOR MANUFACTURING EMBEDDED COMPONENT SUBSTRATE

WIPO Patent Application WO/2014/041659

A1

This method for manufacturing an embedded component substrate is equipped with: a support body formation step, wherein a support body (5) is formed by adhering a metal film (12) on at least both surfaces of a support plate (11); a mounting step, wherein an intermediate body (10) is formed by mounting, on at least one of the surfaces of the support body (5), electric or electronic components (3) and insulating bodies (4); and a lamination step, wherein the insulating bodies (4) are pressed, thereby forming an insulation layer and embedding the components (3) within the insulation layer. In the lamination step a laminated body (15) is formed by stacking multiple intermediate bodies (10), with a support body (5) at the top of the stack, and applying pressure from above and below the laminated body (15).

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SHIMADA HIROSHI (JP)
HIGUCHI TAKAYUKI (JP)
TODA MITSUAKI (JP)

PCT/JP2012/073471

March 20, 2014

September 13, 2012

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MEIKO ELECTRONICS CO LTD (JP)
SHIMADA HIROSHI (JP)
HIGUCHI TAKAYUKI (JP)
TODA MITSUAKI (JP)

H05K3/46

JP2010027917A	2010-02-04
JPH06510399A	1994-11-17
JP2007526141A	2007-09-13
JP2003204167A	2003-07-18
JP2006059952A	2006-03-02

NAGATO, KANJI (JP)
Nagato 侃 2 (JP)

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