Title:
METHOD FOR MANUFACTURING ENDOSCOPE IMAGING DEVICE, ENDOSCOPE IMAGING DEVICE, AND ENDOSCOPE
Document Type and Number:
WIPO Patent Application WO/2020/152782
Kind Code:
A1
Abstract:
This method for manufacturing an endoscope imaging device 1 comprises: a wafer fabrication step S10 for fabricating optical wafers 20W, 30W constituted by hybrid wafers respectively having glass wafers 21W, 31W as substrates and including a plurality of resin lenses 22, 32, and for fabricating a spacer wafer 29W that is made of an inorganic material and includes a plurality of spacers 29; a joining step of directly joining the optical wafers 20W, 30W and the spacer wafer 29W at a temperature lower than the softening point of the plurality of resin lenses 22, 32 to thereby fabricate a joined wafer 10W in which the spaces in which the respective plurality of resin lenses 22, 32 is placed are sealed air-tight; an imaging unit provision step S30 of providing a plurality of imaging units 50 to the joined wafer 10W; and an individualization step S40 of cutting the joined wafer 10W to which the plurality of imaging units 50 have been provided.
Inventors:
FUJIMORI NORIYUKI (JP)
Application Number:
PCT/JP2019/001883
Publication Date:
July 30, 2020
Filing Date:
January 22, 2019
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
A61B1/04; G02B23/24; G02B7/02; H01L27/146; H04N5/225
Domestic Patent References:
| WO2018198266A1 | 2018-11-01 | |||
| WO2017203593A1 | 2017-11-30 | |||
| WO2017203592A1 | 2017-11-30 | |||
| WO2017073440A1 | 2017-05-04 |
Foreign References:
| JP2013531812A | 2013-08-08 | |||
| JP2017032799A | 2017-02-09 | |||
| JP2006292927A | 2006-10-26 | |||
| US20180324336A1 | 2018-11-08 |
Attorney, Agent or Firm:
ITOH-SHIN PATENT OFFICE (JP)
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