Title:
METHOD FOR MANUFACTURING HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING SHEET, AND DEVICE PROVIDED WITH HEAT-CONDUCTING LAYER
Document Type and Number:
WIPO Patent Application WO/2021/054111
Kind Code:
A1
Abstract:
The present invention provides a method for manufacturing a heat-conducting material, whereby a heat-conducting material having exceptional thermal conductivity can be obtained, using a heat-conducting-material-forming composition that has a reduced filler content. The present invention also provides a heat-conducting material, a heat-conducting sheet, and a device provided with a heat-conducting layer. This method for manufacturing a heat-conducting material comprises using a heat-conducting-material-forming composition including an epoxy compound and a phenol compound that includes a compound represented by general formula (P0), the ratio of the number of epoxy groups to the number of phenolic hydroxyl groups being 40/60 to 60/40, and the composition not including a filler, or the filler content being 10 mass% or less with respect to the total solid content when the composition includes a filler, wherein the method includes a pre-curing step and a main curing step.
Inventors:
HITOMI SEIICHI (JP)
NIORI TERUKI (JP)
TAKAHASHI KEITA (JP)
HAYASHI DAISUKE (JP)
NIORI TERUKI (JP)
TAKAHASHI KEITA (JP)
HAYASHI DAISUKE (JP)
Application Number:
PCT/JP2020/033005
Publication Date:
March 25, 2021
Filing Date:
September 01, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08G59/40; H01L23/36
Domestic Patent References:
| WO2014007068A1 | 2014-01-09 | |||
| WO2010140674A1 | 2010-12-09 |
Foreign References:
| JP2018062604A | 2018-04-19 | |||
| JP2003137971A | 2003-05-14 | |||
| JP2017008153A | 2017-01-12 | |||
| JP2004010762A | 2004-01-15 | |||
| JP2012025800A | 2012-02-09 | |||
| JP2013216038A | 2013-10-24 | |||
| JP2006274217A | 2006-10-12 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
Download PDF: