Title:
METHOD FOR MANUFACTURING IC CARD
Document Type and Number:
WIPO Patent Application WO/2005/102729
Kind Code:
A1
Abstract:
A method for manufacturing an IC card preheats an IC card substrate provided with an electronic component integrating an IC chip and an antenna between first and second sheet members through adhesive and then forms bibliographic information and identification information by thermal transfer or ink jet system. Furthermore, there is provided a method for forming bibliographic information and identification information on an IC card substrate provided with an electronic component integrating an IC chip and an antenna between first and second sheet members through adhesive by thermal transfer or ink jet system and then preheating the IC card substrate before forming a surface protective layer on the bibliographic information and identification information. Thus, it is possible to rapidly manufacture an IC card exhibiting good printability and appearance regardless of the environment.
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Inventors:
HATTORI RYOJI (JP)
Application Number:
PCT/JP2005/007293
Publication Date:
November 03, 2005
Filing Date:
April 15, 2005
Export Citation:
Assignee:
KONICA MINOLTA PHOTO IMAGING (JP)
HATTORI RYOJI (JP)
HATTORI RYOJI (JP)
International Classes:
B41J2/325; B41J13/12; B42D15/10; G06K19/07; G06K19/077; B41J2/01; B41J2/32; (IPC1-7): B42D15/10; G06K19/07
Foreign References:
| JPH0655881A | 1994-03-01 | |||
| JP2004127135A | 2004-04-22 |
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