Title:
METHOD FOR MANUFACTURING INPUT AND OUTPUT CIRCUIT-EMBEDDED PACKAGE FOR POWER AMPLIFIER
Document Type and Number:
WIPO Patent Application WO/2020/111321
Kind Code:
A1
Abstract:
The present invention provides a method for manufacturing an input and output circuit-embedded package for a power amplifier, comprising: a dielectric circuit board preparation step including the steps of forming, on a dielectric substrate, a power amplifier hole in which a power amplifier chip is to be arranged, printing an input matching network metal pattern on the left side of the power amplifier hole and an output matching network metal pattern on the right side of the power amplifier hole, and sintering the input matching network metal pattern and the output matching network metal pattern printed on the dielectric substrate; a step of etching an alloy (42), and performing nickel plating so as to prepare a lead frame; and a step of attaching a heat sink onto the lower surface of the dielectric circuit board, attaching the lead frame to the input matching network metal pattern and the output matching network metal pattern of the dielectric circuit board, and then plating, with nickel/gold, the input matching network metal pattern and the output matching network metal pattern of the dielectric circuit board and the lead frame.
Inventors:
LEE SANG-HUN (KR)
HAN KUE-JIN (KR)
HAN KUE-JIN (KR)
Application Number:
PCT/KR2018/014926
Publication Date:
June 04, 2020
Filing Date:
November 29, 2018
Export Citation:
Assignee:
WAVEPIA CO LTD (KR)
KOSTEC SYS CO LTD (KR)
KOSTEC SYS CO LTD (KR)
International Classes:
H01L23/495; H01L23/00; H01L23/498
Foreign References:
| KR20160024744A | 2016-03-07 | |||
| KR20160006257A | 2016-01-18 | |||
| KR20040050313A | 2004-06-16 | |||
| KR20050000918A | 2005-01-06 | |||
| JP2006148976A | 2006-06-08 |
Attorney, Agent or Firm:
JEON, Jong-Il (KR)
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