Title:
METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE HAVING THREE-DIMENSIONAL MULTILAYER STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2007/037106
Kind Code:
A1
Abstract:
A method for manufacturing a three-dimensional multilayer integrated circuit
device in which an electrically insulating adhesive can be placed in the spacing
between semiconductor circuit layers and the portion of the eclectically insulating
adhesive sticking out of the spacing does not need to be removed. Buried interconnection
members (conductive plugs) (15) are formed in a first semiconductor circuit
layer (1a), and the ends thereof are exposed from the back surface of the first
semiconductor layer (1a). Bump electrodes (43a) are formed in positions corresponding
to the plugs (15) on the front surface of a second semiconductor layer (2). An electrically
insulating adhesive film (44a) patterned into a shape not overlapping with the
bump electrodes (43a) is formed on the front surface of the second semiconductor
circuit layer (2). The first and second semiconductor circuit layers (1a, 2)
are made to approach each other, with the back surface of the first semiconductor
circuit layer (1a) opposed to the front surface of the second one (2). Thus, the
adhesive film (44a) is deformed and at least part of the bump electrodes (43a)
are crushed. As a result, the buried interconnection members (15) and the bump
electrodes (43a) are mechanically interconnected, and both circuit layers
(1a, 2) are bonded with the adhesive film (44a).
Inventors:
KOYANAGI MITSUMASA (JP)
Application Number:
PCT/JP2006/317716
Publication Date:
April 05, 2007
Filing Date:
September 07, 2006
Export Citation:
Assignee:
KOYANAGI MITSUMASA (JP)
International Classes:
H01L25/065; H01L21/3205; H01L21/60; H01L23/52; H01L25/07; H01L25/18; H01L27/00
Foreign References:
| JP2001326326A | 2001-11-22 | |||
| JPH08148494A | 1996-06-07 | |||
| JPH0661304A | 1994-03-04 | |||
| JPH0296343A | 1990-04-09 | |||
| JPH0722578A | 1995-01-24 | |||
| JP2005210048A | 2005-08-04 | |||
| JP2004342861A | 2004-12-02 |
Attorney, Agent or Firm:
IZUMI, Katsufumi (Suganuma Bldg. 20-6 Toranomon 1-chom, Minato-ku Tokyo01, JP)
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