Title:
METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING CIRCUIT WIRING, AND TRANSFER FILM
Document Type and Number:
WIPO Patent Application WO/2022/138154
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a method for manufacturing a laminate including a pattern having an excellent pattern shape, a method for manufacturing circuit wiring, and a transfer film. This method for manufacturing a laminate comprises: a bonding step for bringing the surface on the opposite side to the intermediate layer side of a photosensitive composition layer of a transfer film having a temporary support, an intermediate layer, and the photosensitive composition layer in this order into contact with a substrate, and bonding the transfer film and the substrate; a peeling step for peeling the temporary support between the temporary support and the intermediate layer; an exposure step for subjecting the photosensitive composition layer to pattern exposure; and a developing step for developing the exposed photosensitive composition layer using an alkaline developer and forming a pattern. A difference between a contact angle X obtained by measurement X and a contact angle Y obtained by measurement Y is 20 degrees or less.
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Inventors:
MATSUDA TOMOKI (JP)
ISHIZAKA SOJI (JP)
ARIOKA DAISUKE (JP)
ISHIZAKA SOJI (JP)
ARIOKA DAISUKE (JP)
Application Number:
PCT/JP2021/045044
Publication Date:
June 30, 2022
Filing Date:
December 08, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/38; H05K3/06
Domestic Patent References:
| WO2019244898A1 | 2019-12-26 | |||
| WO2010116868A1 | 2010-10-14 |
Foreign References:
| JP2019032474A | 2019-02-28 | |||
| JP2009069589A | 2009-04-02 | |||
| JP2019105761A | 2019-06-27 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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