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Title:
METHOD FOR MANUFACTURING LAMINATE FILM HAVING ADHESIVE LAYER
Document Type and Number:
WIPO Patent Application WO/2023/080065
Kind Code:
A1
Abstract:
A method for manufacturing a laminate film comprises: a step (S2) for performing laser processing from a film layer (30) side on a work film (W) having a carrier film (C), a film layer (10), a raw adhesive layer (20), and the film layer (30) in this order in the thickness direction (H), so as to cut the raw adhesive layer (20) and the film layer (30) on the film layer (10), forming, on the raw adhesive layer (20), an adhesive layer (21) and a surrounding portion (22) surrounding the adhesive layer, and forming, on the film layer (30), a film (31) on the adhesive layer (21) and a surrounding portion (32) surrounding the film; a step (S3) for removing the surrounding portions (22, 32) and the film (31); a step (S4) for bonding, as a film layer (40), an elongated film (40') on the adhesive layer (20) side of the work film (W); and a step (S5) for performing press processing to cut the film layers (10, 40) on a carrier film (S) and form films (11, 41).

Inventors:
TSUTSUMI KIYOTAKA (JP)
MICHISHITA SORA (JP)
YAMAMOTO SHINYA (JP)
Application Number:
PCT/JP2022/040316
Publication Date:
May 11, 2023
Filing Date:
October 28, 2022
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/38; B32B3/02; B32B27/00; B32B37/00; C09J7/40; C09J201/00
Domestic Patent References:
WO2020091064A12020-05-07
WO2019103137A12019-05-31
Foreign References:
JP2015199801A2015-11-12
JP2011057882A2011-03-24
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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