Title:
METHOD FOR MANUFACTURING LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/189328
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a method for manufacturing a laminate which has excellent adhesion between an insulating layer and a conductive layer, and in which the surface of the conductive layer on the side opposite to the insulating layer has small surface roughness. The present invention provides a method for manufacturing a laminate having a base material, an insulating layer, and a conductive layer. The method comprises: a first coating film forming step for applying insulating ink onto the base material by an inkjet recording system to form a first coating film in semi-cured state; a second coating film forming step for applying conductive ink onto the first coating film in semi-cured state by the inkjet recording system to form a second coating film; and a curing step for performing curing processing on the first coating film in semi-cured state and on the second coating film to form an insulating layer and a conductive layer. The curing processing comprises performing firing processing, and thereafter further performing light irradiation processing.
Inventors:
TSUYAMA HIROAKI (JP)
FUJII YUSUKE (JP)
FUJII YUSUKE (JP)
Application Number:
PCT/JP2023/008879
Publication Date:
October 05, 2023
Filing Date:
March 08, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B38/14; B32B37/00; B41J2/01; B41M5/00; C09D11/101; C09D11/30; C09D11/52
Domestic Patent References:
| WO2022004361A1 | 2022-01-06 | |||
| WO2020115285A1 | 2020-06-11 |
Foreign References:
| JP2013042090A | 2013-02-28 | |||
| JP2008034880A | 2008-02-14 | |||
| JPH02218472A | 1990-08-31 | |||
| JP2013203067A | 2013-10-07 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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