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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING LAYERED HOT STAMPING MOLDED BODY AND LAYERED HOT STAMPING MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2021/172379
Kind Code:
A1
Abstract:
[Problem] To solve a problem related to the bending of a steel sheet caused by a difference in a temperature increase rate between a layered part and a sheet part. [Solution] The present manufacturing method comprises: a step for heating a layered blank; a step for transporting the heated layered blank; and a step for pressing the heated layered blank into a mold. In the heating step, when the thicknesses of first and second steel plates are set as t1 and t2, and average heating rates at a plate temperature between 20 °C to 800 °C in a portion of the total plate thickness (t1+t2) of the layered part and a portion of a non-layered part are set as V and v1, the total plate thickness (t1+t2) is 2.5-5.0 mm, and the maximum length L of the layered part is 100-1100 mm. An area S1 of the first steel plate, an area S2 of a portion of the second steel plate overlapping the first steel plate, and the average heating rates V1, v1 satisfy expressions (1) to (3), and heating is performed at a heating temperature and a heating time within a specific range in a coordinate plane defined by the heating time and the heating temperature.

Inventors:
FUJITA SOSHI (JP)
SUZUKI YUKI (JP)
FUDA MASAHIRO (JP)
IRIKAWA HIDEAKI (JP)
MAKI JUN (JP)
YOSHIKAWA NOBUO (JP)
NOMURA NARUHIKO (JP)
Application Number:
PCT/JP2021/006928
Publication Date:
September 02, 2021
Filing Date:
February 24, 2021
Export Citation:
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Assignee:
NIPPON STEEL CORP (JP)
International Classes:
B21D22/20; B21D24/00; C21D1/18; C21D9/00; C22C38/00; C22C38/60
Domestic Patent References:
WO2002103073A22002-12-27
WO2008053273A12008-05-08
Foreign References:
JP6642777B12020-02-12
JP6451327B22019-01-16
JP5509337B22014-06-04
JP2016112569A2016-06-23
JP2016124029A2016-07-11
Other References:
See also references of EP 4082687A4
Attorney, Agent or Firm:
HAGIWARA, Yasushi et al. (JP)
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