Title:
METHOD FOR MANUFACTURING MATERIAL FOR CYLINDRICAL SPUTTERING TARGET
Document Type and Number:
WIPO Patent Application WO/2015/156040
Kind Code:
A1
Abstract:
This method is for manufacturing material for a cylindrical sputtering target formed from copper or a copper alloy and is provided with a continuous casting step for casting a cylindrical ingot with an average crystal grain size of 20 mm or less using a continuous casting machine or a semi-continuous casting machine and a cold rolling processing step and heat treatment step for forming material for the cylindrical sputtering target that has an average crystal grain size of 10 - 150 µm on the outer peripheral surface and wherein the surface area proportion of crystal grains of two times or greater the average crystal grain size is less than 25% of the total crystal surface area by repeatedly executing the cold rolling step and heat treatment on this cylindrical ingot.
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Inventors:
SAKURAI AKIRA (JP)
KUMAGAI SATOSHI (JP)
SONOHATA TAKASHI (JP)
OHTO MICHIAKI (JP)
KUMAGAI SATOSHI (JP)
SONOHATA TAKASHI (JP)
OHTO MICHIAKI (JP)
Application Number:
PCT/JP2015/054788
Publication Date:
October 15, 2015
Filing Date:
February 20, 2015
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22F1/08; C23C14/34; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22C9/06; C22F1/00
Domestic Patent References:
| WO2013031381A1 | 2013-03-07 |
Foreign References:
| JP2013076129A | 2013-04-25 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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