METHOD FOR MANUFACTURING METAL BASE WIRING BOARD, AND METAL BASE WIRING BOARD

WIPO Patent Application WO/2012/127838

A1

Provided are a method for manufacturing a metal base wiring board, whereby the whole through hole can be suitably filled with a resin by suppressing voids, and the metal base wiring board. The method for manufacturing a metal base wiring board is characterized in that: on the rear surface of a circuit substrate (3A), which is provided with a wiring portion and a through hole (9A), and which has a power element mounted on the front surface, a metal base (7A) is laminated by having an insulating material (5A) therebetween, said insulating material being provided with heat conductivity and viscosity; lamination gaps among the circuit substrate (3A), the insulating material (5A) and the metal base (7A) are heated and pressurized by means of heat plates (25, 27); the insulating material (5A) is applied to the inside of the through hole (9A) by being moved therto, while suppressing an inner pressure increase of the through hole (9A) by releasing air through a sheet (31); and the circuit substrate, an insulating layer formed by solidifying the insulating material (5A), and the metal base are laminated.

SAITO TATSUYA (JP)
KOBAYASHI YASUYOSHI (JP)
NAGAOKA EIKI (JP)

PCT/JP2012/001859

September 27, 2012

March 16, 2012

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NHK SPRING CO LTD (JP)
SAITO TATSUYA (JP)
KOBAYASHI YASUYOSHI (JP)
NAGAOKA EIKI (JP)

H05K3/44; H05K1/02; H05K1/05

JPH11145627A	1999-05-28
JPH098426A	1997-01-10
JP2006237211A	2006-09-07
JP2006147766A	2006-06-08
JPH06177275A	1994-06-24
JP2001244638A	2001-09-07

SUDO, Yuichi (JP)
Yuichi Sudo (JP)

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