Title:
METHOD FOR MANUFACTURING METAL-FILLED MICROSTRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/044585
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a metal-filled microstructure having good electric conductivity. The method for manufacturing a metal-filled microstructure has: a preparation step for preparing a structure having a plurality of conductors and a resin layer, the conductors being provided in a state of penetrating a dielectric film in a thickness direction and of being electrically insulated from each other, the conductors sticking out from one face of the dielectric film in the thickness direction, the face of the dielectric film, where the conductors stick out, being covered with the resin layer; a heating step for heating at least the resin layer in an atmosphere where an oxygen partial pressure is at most 10000 Pa; and a removal step for removing the resin layer heated in the heating step, from the dielectric film. The resin layer includes a heat-releasable adhesive.
Inventors:
KAWAGUCHI JUNJI (JP)
HOTTA YOSHINORI (JP)
HOTTA YOSHINORI (JP)
Application Number:
PCT/JP2021/026287
Publication Date:
March 03, 2022
Filing Date:
July 13, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C25D11/04; C25D11/18; C25D11/20; C25D11/24; C25D11/26; C25D11/34
Domestic Patent References:
| WO2018037805A1 | 2018-03-01 | |||
| WO2017057150A1 | 2017-04-06 | |||
| WO2019039071A1 | 2019-02-28 |
Foreign References:
| JP2011090865A | 2011-05-06 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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