Title:
METHOD FOR MANUFACTURING METAL LATTICE, METAL LATTICE, X-RAY IMAGING DEVICE, AND INTERMEDIATE PRODUCT FOR METAL LATTICE
Document Type and Number:
WIPO Patent Application WO/2013/088647
Kind Code:
A1
Abstract:
This method for manufacturing a metal lattice comprises: forming a recess on a principal surface of a silicon substrate; forming a first insulating layer on the surface at the side at which the recess has been formed; removing the first insulating layer formed at the bottom part of the recess; and filling the recess with a metal by electroforming. In the present invention, an opening portion communicating to the exterior is formed on part of a wall part of the recess, and a silicon substrate surface is exposed at the outside of the opening portion. Before the recess is filled with the metal, a second insulating layer is formed on the silicon substrate surface at the outside of the opening portion. Therefore, according to this method for manufacturing a metal lattice, it is possible to improve circulation of the plating solution in electroforming, and improve the rate of growth of the metal. The present invention also provides a metal lattice manufactured according to this manufacturing method, and an X-ray imaging device in which this metal lattice is used. The present invention also provides an intermediate product for a metal lattice, obtained prior to the recess being filled with the metal.
Inventors:
YOKOYAMA MITSURU (JP)
Application Number:
PCT/JP2012/007449
Publication Date:
June 20, 2013
Filing Date:
November 20, 2012
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
C25D7/00; A61B6/06; C25D5/02; C25D7/12; G01N23/04; G01T7/00; G02B5/18
Foreign References:
| JP2011157622A | 2011-08-18 | |||
| JP2010185728A | 2010-08-26 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
Etsuji Kotani (JP)
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Claims: