Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR MANUFACTURING METAL SUBSTRATE HAVING PATTERN FORMED THEREON AND METAL HAVING PATTERN FORMED THEREON MANUFACTURED THEREBY
Document Type and Number:
WIPO Patent Application WO/2018/074711
Kind Code:
A1
Abstract:
The present invention relates to a method for manufacturing a metal substrate with a pattern formed thereon capable of preventing cracking, abrasion and peeling due to an external force as compared to a conventional plating method or a method using mechanical coupling. The method comprises: a pattern forming step of forming a pattern on an upper surface of a metal substrate (100); a pattern layer forming step of forming a pattern layer (200) along the pattern formed on the metal substrate (100); and a heat treatment step of heat-treating the metal substrate (100) which has passed through the pattern layer forming step. A diffusion coefficient of a metal forming the pattern layer (200) is larger than a diffusion coefficient of a metal forming the metal substrate (100).

Inventors:
KIM MYUNGYONG (KR)
BYUN GYEONGJUN (KR)
Application Number:
PCT/KR2017/008079
Publication Date:
April 26, 2018
Filing Date:
July 27, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KOREAMINT (KR)
International Classes:
C23C10/04; B21D17/02; B22F3/02; C23C4/01; C23C18/16; C23C24/02; C23F4/00; C25D5/02
Foreign References:
KR20150078702A2015-07-08
KR0149993B11998-12-15
KR101015613B12011-02-17
JP2000151080A2000-05-30
KR20090018567A2009-02-20
Other References:
KOMSCO, 3RD NEW TECHNOLOGY FAIR FOR THE FORGERY PREVENTION KOMSCO SECURITY TECHNOLOGY, 26 September 2016 (2016-09-26), pages 1 - 8
Attorney, Agent or Firm:
PLUS INTERNATIONAL IP LAW FIRM (KR)
Download PDF: