Title:
METHOD FOR MANUFACTURING MICROSCOPIC STRUCTURAL BODY
Document Type and Number:
WIPO Patent Application WO/2016/013655
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a microscopic structural body with which it is possible to easily produce a composite pattern and/or a nesting structure. The present invention provides a method for manufacturing a microscopic structural body, provided with a step for: forming a first cured resin layer onto which a first pattern of a first mold is transferred by emitting an active energy beam onto a first transfer resin layer through the first mold when the first pattern has been pushed against the first transfer resin layer, the first transfer resin layer being obtained by applying a first photo-curable resin composition onto a transparent base having a light-shielding pattern; and forming a second cured resin layer having an uneven shape including a low step part and a high step part by emitting an active energy beam onto a second transfer resin layer using the light-shielding pattern as a mask to cure a region that is a portion of the second transfer resin layer when a second pattern of a second mold is pushed against the second transfer resin layer, the second transfer resin layer being obtained by applying a second photo-curable resin composition onto the first cured resin layer, at least one of the first and the second patterns having a microscopic configuration.
Inventors:
MIYAZAWA YUKIHIRO (JP)
Application Number:
PCT/JP2015/071102
Publication Date:
January 28, 2016
Filing Date:
July 24, 2015
Export Citation:
Assignee:
SOKEN KAGAKU KK (JP)
International Classes:
H01L21/027; B29C59/02
Foreign References:
| JP2010074162A | 2010-04-02 | |||
| US20080305410A1 | 2008-12-11 | |||
| JP2008213273A | 2008-09-18 | |||
| JP2003249444A | 2003-09-05 |
Other References:
See also references of EP 3196924A4
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
SK patent business corporation (JP)
SK patent business corporation (JP)
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