Title:
METHOD FOR MANUFACTURING ORGANIC ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/262110
Kind Code:
A1
Abstract:
The present invention provides a method for manufacturing an organic electronic device of superior long-term shelf-life in which the occurrence of deformations, such as wrinkles, in a seal member is suppressed. The present invention pertains to a method for manufacturing an organic electronic device, the method comprising: a step for forming an organic electronic device substrate comprising a first electrode, an organic functional layer, and a second electrode in that order on a main surface of a support substrate; a step for drying a seal member in which a resin layer, a metal layer, and an adhesive layer have been stacked in that order; and a step for bonding the dried seal member to the organic electronic device substrate via the adhesive layer, wherein the metal layer has a load capacity of 100–200 N/mm2.
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Inventors:
SHIMOGAWARA MASAYA (JP)
MORISHIMA SHINICHI (JP)
FUJII TAKASHI (JP)
MORISHIMA SHINICHI (JP)
FUJII TAKASHI (JP)
Application Number:
PCT/JP2020/023581
Publication Date:
December 30, 2020
Filing Date:
June 16, 2020
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
H01L51/44; H01L21/336; H01L29/786; H01L51/50; H05B33/04; H05B33/10
Domestic Patent References:
WO2011052630A1 | 2011-05-05 | |||
WO2018181426A1 | 2018-10-04 |
Foreign References:
JP2008269964A | 2008-11-06 | |||
JP2010181749A | 2010-08-19 | |||
JP2017222071A | 2017-12-21 | |||
JP2011003522A | 2011-01-06 |
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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